LED (SMD) package taping device "iMAG"
Electrical characteristic tests and wavelength/luminance characteristic inspections are also conducted simultaneously to automatically eject defective products!
Electrical characteristic tests and wavelength/luminance characteristic inspections are conducted simultaneously to automatically eject defective products! Conversion between Top View and Side View is possible with dedicated parts! (Optional) Even after tape insertion, defective products can be automatically replaced through image inspection! (Optional)
- Company：ハイメカ
- Price：10 million yen-50 million yen
